Moldable Thermal Pad – Thermally Conductive Silicone Clay for Custom Cooling
Customize your thermal solutions with our non-curing, moldable silicone-based thermal pad. Designed for high-performance applications, this clay-like compound fills gaps with precision, offering optimal thermal conductivity and long-term stability.
Key Features:
- High Thermal Conductivity – Efficiently transfers heat away from components.
- Moldable & Flexible – Easily shapes to fit irregular surfaces and spaces.
- Non-Curing Formula – Remains soft and reusable, no curing time needed.
- Wide Operating Range – Stable performance from -40°C to +200°C.
- Safe & Non-Toxic – RoHS compliant, ideal for DIY and professional use.
️ Perfect For:
- CPUs, GPUs, SSDs, and other heat-sensitive components
- Electronic modules, power devices, and LED lighting
- Repair, prototyping, and custom thermal management solutions
Choose the moldable thermal pad trusted by engineers and makers worldwide. No mess. No curing. Just results.
